الفهرس 
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Abstract
Improving corrosion resistance of copper is often associated
with the presence of cuprous oxide (Cu2O) films on the
surface. Many surface modification techniques such as
chemical etching, oxidation, inhibitors, electro deposition and
sol-gel could be employed
In the present work a film of Cu2O, which is considered to be
protective and strongly adherent to the substrate, is formed.
Experimental technique includes etching of copper specimens
in ammonia solution, calcination, and then immersed in ethanol
solution of stearic acid for different times was employed
Etching of copper for 60 hr in 10 wt. % ammonia solution
exhibited a contact angle of 135˚, however the formed layer,
which is CuO, has poor adhesion.
Immersion of etched-calcined copper in 0.1 m0l/L ethanol
solution of stearic acid for 3 hr showed a superhydrophobic
Cu2O film with a contact angle of 160˚ and good adhesion. The
contact angle was measured at ambient temperature using
Attension Biolin device (Model: Theta Optical Tensiometers).
Electrochemical measurements revealed that a significant
improvement in corrosion resistance of pure copper in 3%
NaCl had been achieved.
The surface morphology and chemical compositions of the
samples were investigated with a scanning electron
microscopy, EDX and an X-ray diffraction. Electrochemical
corrosion behavior was conducted in 3 wt. % NaCl aqueous
solution at room temperature. Also Thickness (using Tooke
Inspection Guage OG204 according to ASTM D4138) and
adhesion (using X-Cut Tape Adhesion test according to ASTM
D3359) of the formed films were determined.