الفهرس | Only 14 pages are availabe for public view |
Abstract Improving corrosion resistance of copper is often associated with the presence of cuprous oxide (Cu2O) films on the surface. Many surface modification techniques such as chemical etching, oxidation, inhibitors, electro deposition and sol-gel could be employed In the present work a film of Cu2O, which is considered to be protective and strongly adherent to the substrate, is formed. Experimental technique includes etching of copper specimens in ammonia solution, calcination, and then immersed in ethanol solution of stearic acid for different times was employed Etching of copper for 60 hr in 10 wt. % ammonia solution exhibited a contact angle of 135˚, however the formed layer, which is CuO, has poor adhesion. Immersion of etched-calcined copper in 0.1 m0l/L ethanol solution of stearic acid for 3 hr showed a superhydrophobic Cu2O film with a contact angle of 160˚ and good adhesion. The contact angle was measured at ambient temperature using Attension Biolin device (Model: Theta Optical Tensiometers). Electrochemical measurements revealed that a significant improvement in corrosion resistance of pure copper in 3% NaCl had been achieved. The surface morphology and chemical compositions of the samples were investigated with a scanning electron microscopy, EDX and an X-ray diffraction. Electrochemical corrosion behavior was conducted in 3 wt. % NaCl aqueous solution at room temperature. Also Thickness (using Tooke Inspection Guage OG204 according to ASTM D4138) and adhesion (using X-Cut Tape Adhesion test according to ASTM D3359) of the formed films were determined. |