الفهرس | Only 14 pages are availabe for public view |
Abstract The present thesis mainly covers: 1)Thermal analysis and microstructure evolutions of the plain solder Sn-1wt%Ag–0.5wt%Cu (SAC105), SAC105–1wt%Zn and SAC105–1wt%Zn-0.2wt% GONSs composite solder. 2)The effect of different strain rates, ε• from 5.4 x 10-5 to 179 x 10-5 S-1 and testing temperatures, Tt in the range of 300 to 393 K on stress-strain characteristics of SAC105 plain, SAC105-Zn and SAC105-Zn-GONSs composite solders. 3)Experimental results of the stress relaxation of the three solders under different strain rates ε• from 5.4 x 10-5 to 179 x 10-5 S-1 and different testing temperatures from 300 to 393 K. 4)Experimental results of the tensile creep characteristics of the three solder alloys under different levels of stress ( = 7.8, 9.75 and 11.7 MPa) and testing temperature (Tt= 300, 333, 353 and 373K). |