الفهرس 
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Abstract
This work deals with the study of the effect of organic polymers additives on the electroplating process of copper organized into three chapters .
The first Chapter is the introduction that consists of following topics:
i. Theoretical background for copper electrodeposition.
ii. Mass transfer during electrolysis.
iii. Dimensional analysis method.
iv. Effect of additives on electrodeposition kinetics.
v. The literature survey on the previous topics.
vi. Aim of the work
The second chapter devoted for the experimental method used in this work and the cell used and the procedure of measuring the limiting current in both cases of copper electrodeposition using Cu-Cu and Cu-Stainless steel cells.
The organic polymers which were used as additives are PEG-400, PEG-4000, PEG-6000 and poly vinyl alcohol.
In addition, this chapter contains the methods of measurements of physical properties of solution (density and viscosity and diffusion coefficient) at different concentrations and temperatures in absence and presence of organic polymers .
The third Chapter concerned with results and discussion and it includes.
The effect of these polymers on the copper electrodeposition from acidic sulphate bath. The primary characteristics studied included limiting current inhibitor efficiency, different models of adsorption isotherm, temperature, rotation. As a result:
1. The presence of these organic polymers had a major negative impact of limiting current.
2. The values of % inhibition increase with increasing inhibitor concentration.
3. The adsorption of inhibitors on copper and Stainless steel surfaces obeys Temkin,Flory -Huggins and kinetic adsorption isotherm.
4. The values of (K ads.) and (ΔGads.) indicated that all the inhibitors strongly adsorbed on stainless steel surface more than in case of copper surface.
5. The Ea values of the electrodeposition reaction for the inhibited solutions are higher than that for the uninhibited solutions indicating good inhibitor characteristics associating with physical adsorption.
6. Using RCE in case of cupper at 25°C, we found that the limiting current density increase by increasing the speed of rotation so the reaction is diffusion controlled.
7. The values of thermodynamic parameters ΔH* (kJmol-1), ΔS* (J.mol-1 k-1) and ΔG* (kJmol-1) are represented.
The results show positive sign of ΔH*, reflecting the endothermic nature of the adsorption process. The negative values of ΔS* pointed to greater order produced during the process of activation indicating more ordered and not random distribution of ions.ΔG* values show limited increase with rise in the concentration of organic polymer additives i.e.: ΔG* values of inhibited systems were more positive than that for the uninhibited systems.
8. Values of Isokinetic temperature β is more than the experimental temperature (298K) for all polymers in case of (Cu-Cu,Cu-Stainless steel ) cells so the reaction rate is Enthalpy controlled except in case of PEG-400 at (Cu-Stainless steel cell) where the value of β is less than 298K so the reaction rate is Entropy controlled.9.The dimensionless groups Sh (Sherwood number), Sc (Schmidt number) and Re (Reynolds number) were calculate for rotating cupper cylinder electrode and the relations between them were given. The next table gives overall relation of all organic.