الفهرس 
Aim of The study
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Abstract
Sn-Pb solder alloy for metal interconnections has a long history, dating back 2000 years. These alloys are the dominant solders used widely in manufacture because of their unique combination of material properties, such as low cost, availability, low melting temperatures, ductility and excellent wetting on Cu and its alloys. It is well known that conventional Pb-containing solders are harmful to both people’s health and environment, so the exploration of lead-free solders as substitute of lead-tin alloys is paid more attention, especially with the arrival of legislative restriction on the use of lead solders by European Union to pass legislation prohibiting or restricting the use of Pb–Sn solders. The lead-free solders used in electronic industry need to meet a series of standards: good wettability, low melting point, low cost and adequate strength. At present, a number of investigations have been carried out on such promising lead-free solder alloys as Sn-Ag, Sn-Ag-Cu, Sn-Cu, Sn-Zn, Sn-Bi and Sn-In. Among these alloys, the Sn-Ag-Cu system solder becomes one of the most future solders because of its excellent wetting and mechanical properties. However, it also has some disadvantages, such as poor creep-rupture.