الفهرس 
IntroductionOnly 14 pages are availabe for public view
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Abstract
Sn-Pb soldering for metal interconnections has a long history, dating back 2000 years. These alloys are the dominant solders used widely in manufacture because of their unique combination of material properties, such as easy handling, low melting temperatures, good workability, ductility and excellent wetting on Cu and its alloys. It is well known that conventionallead- containing solders are harmful to both people’s health and environment, so the exploration of lead-free solders as substitute of lead-tin alloys is paid more attention.The lead-free solders used in electronic industry need to meet a series of standards: good wettability, low melting point, low cost and adequate strength. At present, a number of investigations have been carried out on such promising lead-free solder alloys as Sn-Ag, Sn-Cu, Sn-Zn, Sn-Bi and Sn-In. Among these alloys, the Sn-Ag-Cu system solder becomes one of the most future solders because its excellent wetting and mechanical properties. However, it also has some disadvantages, such as poor creep-rupture and low elongation. The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloy can have a significant influence on the mechanical strength of solder joints.