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العنوان
An Image Sensor Design For Capsule Endoscopes With Architecture Modeling And Simulation/
المؤلف
Elhebeishy, Alyaa
الموضوع
Image Sensor. Electrical Simulation.
تاريخ النشر
2010 .
عدد الصفحات
103 p. :
اللغة
الإنجليزية
الدرجة
ماجستير
التخصص
الهندسة الكهربائية والالكترونية
مكان الإجازة
جامعة الاسكندريه - كلية الهندسة - كهرباء
الفهرس
Only 14 pages are availabe for public view

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Abstract

The remarkable progress achieved in the CMOS image sensing technology over the past
few decades led to the proliferation of CMOS imagers in many applications. Bio-medical
devices development is one of the most important applications for the CMOS sensors. The
4- T active pixel is the most widely used architecture in the current technology.
Endoscopy is a minimally invasive diagnostic medical procedure which is used to provide
images for visual inspection and photography of the digestive tract. Capsule endoscopes
are the latest technology developed for imaging the GI tract. A capsule endoscope contains
an image sensor that captures images of the GI tract and transmits them wirelessly to a
receiver kept near the patient. The capsule endoscope eliminates completely the need of
surgical invasion.
In this thesis a model is presented illustrating the operation of the 4- T pinned photodiode
pixel and a design for an image sensor chip is proposed to be implemented in a capsule
endoscope.
In chapter one, an introduction to endoscopy, its types and the technology of capsule
endoscopy are provided. Chapter two illustrates the fundamentals of imaging and the
imaging devices’ performance parameters. Chapter three contains the developed model of
the 4- T pinned photodiode architecture and the simulation results of the readout circuits.
The model consists of three cascaded stages which are the pinned photodiode, the CDS
readout circuit and the subtractor circuit.
Chapter four discusses different types of ADCs and a selection of a design to be
implemented with the image sensor in the proposed chip for to be integrated in a capsule
endoscope. Chapter five includes the £1oorplan for the proposed chip with the introduction
of BSI concept. Chapter six demonstrates different types of packaging techniques with the
recommendation of MVP for the design. Chapter seven contains summary and conclusion
for the previous chapters.